A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material

Electrochemical migration (ECM) of sintered nano-Ag could be a serious reliability concern for power devices with high-density packaging. An anti-ECM nano-Ag-SiOx paste was proposed by doping 0.1wt% SiOx nanoparticles rather than previously used expensive noble metals, e.g., palladium. The ECM lifetime the 1.5 to 3 times longer that nano-Ag, due fact protect Ag from oxidation. thermo-mechanical also improved sintering under 5 MPa assisted pressure. lesser porosity and smaller grain boundaries beneficial retard silver ECM. In end, double-sided semiconductor device demonstrated validate better resistance using nano-Ag-SiOx.